Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > OFC > 2004 > ThL > ThL1
  • Optical Fiber Communication Conference
  • Technical Digest (CD) (Optica Publishing Group, 2004),
  • paper ThL1

Packaging of highly integrated PLC components

D. Krabe, G. Heise, M. Zavrsnik, J. Dieckroeger, Zhan Gao, Christoph Schinke, Manfred Scheubeck, Tobias Kraeker, Bernd Krombholz, and Ingo Baumann

Not Accessible

Your library or personal account may give you access

Abstract

We discuss the progress of packaging techniques for highly integrated Planar Lightwave Circuit (PLC) devices. Examples of thermal effects and the integration of power monitors demonstrate interactions between building blocks and the environment.

© 2004 Optical Society of America

PDF Article
More Like This
Compactly integrated 32-channel AWG multiplexer with variable optical attenuators and power monitors based on multi-chip PLC technique

S. Suzuki, Y. Inoue, S. Mino, M. Ishii, I. Ogawa, R. Kasahara, Y. Doi, Y. Hashizume, and T. Kitagawa
ThL2 Optical Fiber Communication Conference (OFC) 2004

Integrated circuits on-PLC integration

Shinji Mino, Shunichi Sohma, Motohaya Ishii, and Masayuki Okuno
WC6 Optical Fiber Communication Conference (OFC) 2004

Hybrid integration of active devices on PLC

T. Hashimoto, T. Kitagawa, I. Ogawa, and S. Suzuki
ThL4 Optical Fiber Communication Conference (OFC) 2004

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use