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Conferences > OFC > 2001 > WDD > WDD67
  • Optical Fiber Communication Conference and International Conference on Quantum Information
  • 2001 OSA Technical Digest Series (Optica Publishing Group, 2001),
  • paper WDD67
  • •https://doi.org/10.1364/OFC.2001.WDD67

High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique

T. Miyahara, S. Kaneko, M. Noda, M. Ishizaki, Y. Kitamura, K. Takagi, H. Tada, T. Hatta, and K. Kasahara

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Abstract

High-capacity transmission systems with aggregate capacities of more than 1 Tbit/s [1], [2] are realized by using wavelength division multiplexing (WDM). Even in WDM systems, higher bit-rates, e.g. 40 Gbit/s [3], [4], 80 Gbit/s [5] and more, generated by electrical time division multiplexing (ETDM) technology, are favorable because they reduce terminal cost and offer high spectral efficiency.

© 2001 Optical Society of America

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