Packaging of optoelectronic devices with high coupling efficiency using silicon V-groove technology

T. Bricheno; H.F.M. Priddle; R.G. Peall; D. Spear; D. Spear

Optical Fiber Communication Conference
1998 OSA Technical Digest Series (Optica Publishing Group, 1998),
paper ThS4

Packaging of optoelectronic devices with high coupling efficiency using silicon V-groove technology

T. Bricheno, H.F.M. Priddle, R.G. Peall, and D. Spear

Optical Fiber Communication Conference 1998

San Jose, California United States
ISBN: 1-55752-529-3

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Optoelectronic Packaging (ThS)

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T. Bricheno, H. F. M. Priddle, R. G. Peall, and D. Spear, "Packaging of optoelectronic devices with high coupling efficiency using silicon V-groove technology," in Optical Fiber Communication Conference, Vol. 2 of 1998 OSA Technical Digest Series (Optica Publishing Group, 1998), paper ThS4.

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Abstract

Volume manufacturing of optical devices using the silicon V-groove (or silicon motherboard) technology is now well established.¹

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