Plastic encapsulated 1.3-μm laser on Si substrate for long-haul transmission

C. Artigue; S. Rabaron; D. Toullier; A. Lestra; D. Tregoat; J-L. Lafragette; E. Grard; B. Fernier; W. Jörg; W. Jörg; J. Scherb; J. Scherb; G. Seibold; G. Seibold; A. Göth; A. Göth

Optical Fiber Communication Conference
1998 OSA Technical Digest Series (Optica Publishing Group, 1998),
paper ThS3

Plastic encapsulated 1.3-μm laser on Si substrate for long-haul transmission

C. Artigue, S. Rabaron, D. Toullier, A. Lestra, D. Tregoat, J-L. Lafragette, E. Grard, B. Fernier, W. Jörg, J. Scherb, G. Seibold, and A. Göth

Optical Fiber Communication Conference 1998

San Jose, California United States
ISBN: 1-55752-529-3

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Optoelectronic Packaging (ThS)

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C. Artigue, S. Rabaron, D. Toullier, A. Lestra, D. Tregoat, J. Lafragette, E. Grard, B. Fernier, W. Jörg, J. Scherb, G. Seibold, and A. Göth, "Plastic encapsulated 1.3-μm laser on Si substrate for long-haul transmission," in Optical Fiber Communication Conference, Vol. 2 of 1998 OSA Technical Digest Series (Optica Publishing Group, 1998), paper ThS3.

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Abstract

Passive alignment of optoelectronic components with fibers¹ and their plastic encapsulation² have received strong attention in the recent years for high volume at lower cost production.

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