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Optica Publishing Group
  • Optical Fiber Communication Conference
  • 1996 OSA Technical Digest Series (Optica Publishing Group, 1996),
  • paper TuJ3

Manufacturing and packaging of optoelectronic components

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Abstract

Wide-scale system deployment of optoelectronic components requires continuing reductions in product selling price. Particularly price-sensitive applications include computer local area networks and fiber-to-the-curb interconnects. To satisfy market needs a successful manufacturer must have a highly flexible, efficient, and robust production capability. This paper reviews how device technologies, assembly techiuques, packaging materials, and designs are evolving to meet this challenge without sacrificing component quality and reliability.

© 1996 Optical Society of America

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