Abstract

The pursuit of reliable and accurate alignment presents one of the greatest challenges to packaging technologies used for optoelectronic components. In recent years the spot-welding technique has been used extensively. Although a number of studies of welding have been published, most have been based on large joints in which micromovement is not an issue. In this paper we present the results of a reliability study of receptacle laser packages, which have high sensitivity to mechanical alignment.

© 1994 Optical Society of America