Abstract

Now the focus for accomplishing high-speed optoelectronic components has shifted to the packaging area. Careful considerations are required to achieve high-speed performance, and satisfying these requirements has led to the application of many leading electronic packaging technologies. This tutorial covers packaging issues for optical communication equipment and modules, advanced electronic packaging techniques focusing on inside-the-module packaging techniques, and the electrical barriers in packaging of future ultrahigh-speed optoelectronics

© 1994 Optical Society of America