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Packaging requirements for a dense optical receiver array

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Abstract

Interactions between system components, both in the optical domain and in the electrical domain, become a major concern in a dense optical interconnectenvironment.1 In addition to the thermal noise, signals from different channels can interfere with each other either through parasitic capacitance between adjacent channels or through the sharing of a common power supply. Optical receiver design for such an environment thus requires minimizing the combined thermal noise and coupling noise.

© 1991 Optical Society of America

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