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Conferences > OECC_PS > 2013 > TuT3 > TuT3_5
  • 2013 18th OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching
  • (Optica Publishing Group, 2013),
  • paper TuT3_5
  • •https://doi.org/10.1364/OECC_PS.2013.TuT3_5

Optical Transceiver ICs based on 3D Die-Stacking of Opto-electronic Devices

Pinxiang Duan, Oded Raz, and Harmen JS Dorren

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Abstract

We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.

© 2013 IEICE

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