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Conferences > OECC > 2021 > W3C > W3C.4

Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging

S. Suda, T. Kurosu, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, K. Takemura, D. Shimura, Y. Onawa, H. Yaegashi, T. Aoki, and T. Amano

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Abstract

We demonstrate temperature insensitive operation of an active optical package substrate comprising of silicon waveguide, two micro-mirrors and polymer waveguide. Transmission of 112-Gb/s PAM4 optical signal was performed without noticeable penalty at 85 °C.

© 2021 The Author(s)

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