Abstract

Recess mounting with monolithic metallization, or RM3 integration, is being used to integrate a variety of optoelectronic devices on silicon CMOS circuits to produce high performance optoelectronic integrated circuits. In RM3 integration, partially processed heterostructure devices are placed in recesses formed in the dielectric layers covering the surface of an integrated circuit chip, the surface is planarized, and monolithic processing is continued to transform the heterostructures into optoelectronic devices monolithically integrated with the underlying electronic circuitry.

© 2003 Optical Society of America

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