Chip-to-Chip Multipoint Optoelectronic Interconnections

Donald M. Chiarulli; Steven P. Levitan; John Hansson; Michael Weisser

doi:10.1364/OC.2003.OThD4

Optics in Computing
OSA Trends in Optics and Photonics (Optica Publishing Group, 2003),
paper OThD4
•https://doi.org/10.1364/OC.2003.OThD4

Chip-to-Chip Multipoint Optoelectronic Interconnections

Donald M. Chiarulli, Steven P. Levitan, John Hansson, and Michael Weisser

Optics in Computing 2003

Washington, D.C. United States
16–20 June 2003
ISBN: 1-55752-750-4

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Optical Interconnects: Demonstrations (OThD)

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D. M. Chiarulli, S. P. Levitan, J. Hansson, and M. Weisser, "Chip-to-Chip Multipoint Optoelectronic Interconnections," in Optics in Computing, A. Sawchuk, ed., Vol. 90 of OSA Trends in Optics and Photonics (Optica Publishing Group, 2003), paper OThD4.

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Abstract

We present a new class of interconnection solutions for centimeter scale, board and backplane level, optoelectronic interconnections that combines the high density of free space optical interconnections with the flexibility and relaxed geometry of fiber optic links.

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