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Flip Chip Bonded Optoelectronic Devices on Ultra-Thin Silicon-on-Sapphire for Parallel Optical Links

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Abstract

We describe flip chip bonding of arrayed optoelectronic devices (VCSELs, MSM and PIN detectors) onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 2.5 Gbps (and higher) parallel optical links.

© 2001 Optical Society of America

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