Abstract
Through-focus Scanning Optical Microscope (TSOM) technology, which has been attracting much attention in the field of semiconductor measurement recently, using a conventional optical microscope, collects 2D images at multiple focal positions for creating 3D data space and extracts intensity profile from them. It is a breakthrough technology for the inspection and measurement of a recent complicated 3D structure semiconductor.
© 2017 Japan Society of Applied Physics, Optical Society of America
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