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Optica Publishing Group
  • International Quantum Electronics Conference
  • 1996 OSA Technical Digest Series (Optica Publishing Group, 1996),
  • paper ThG2

Fundamentals and applications of materials processing with copper vapour lasers

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Abstract

The Copper Vapour Laser (CVL) offers, due to the unique combination of having a green wavelength, pulse durations in the nanosecond range and repetition rates of several thousands per second, a suitable tool for precise and effective micro-materials processing [1,2]. In previous publications, on machining examples we have shown that a 140W- CVL unit in oscillator-amplifier-configuration provides a high precision in the removing, drilling or cutting of metallic, ceramic, glassy and natural materials. The aim of this work lies with a time resolved presentation of the materials removal process induced by CVL pulses, and the description of the influencing variables that affect the resulting drilling depths, which are only due to the materials properties.

© 1996 Optical Society of America

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