Abstract
The Copper Vapour Laser (CVL) offers, due to the unique combination of having a green wavelength, pulse durations in the nanosecond range and repetition rates of several thousands per second, a suitable tool for precise and effective micro-materials processing [1,2]. In previous publications, on machining examples we have shown that a 140W- CVL unit in oscillator-amplifier-configuration provides a high precision in the removing, drilling or cutting of metallic, ceramic, glassy and natural materials. The aim of this work lies with a time resolved presentation of the materials removal process induced by CVL pulses, and the description of the influencing variables that affect the resulting drilling depths, which are only due to the materials properties.
© 1996 Optical Society of America
PDF ArticleMore Like This
H. W. Bergmann, R. Mayerhofer, T. Slunecko, M. Hartmann, and E. Gan
CThE3 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 1994
E. K. Illy, A. C.J. Glover, and J. A. Piper
ThG3 International Quantum Electronics Conference (IQEC) 1996
RI Trickett, MJ Withford, and DJW Brown
FE5 International Quantum Electronics Conference (IQEC) 1996