Abstract

Recent advances on hybrid III-V silicon photonic integrated circuits using a wafer bonding technique are reported, with particular attention on the wavelength division multiplexing transmitters integrating distributed feedback lasers and semiconductor optical amplifiers.

© 2015 Optical Society of America

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More Like This
Hybrid III-V/silicon integration for photonic integrated circuits on silicon

Guang-Hua Duan
ITh2A.2 Information Optoelectronics, Nanofabrication and Testing (IONT) 2012

Heterogeneous III-V/silicon photonic integrated circuits

G. Roelkens, S. Keyvaninia, Y. De Koninck, P. Mechet, T. Spuesens, M. Tassaert, S. Stankovic, G. Morthier, R. Baets, D. Van Thourhout, F. Lelarge, G.-H. Duan, S. Messaoudene, J.M. Fedeli, T. De Vries, B. Smalbrugge, E.J. Geluk, J. Bolk, and M. Smit
ATh3A.5 Asia Communications and Photonics Conference (ACPC) 2013

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W1B.1 Optical Fiber Communication Conference (OFC) 2015