Abstract
Recent advances on hybrid III-V silicon photonic integrated circuits using a wafer bonding technique are reported, with particular attention on the wavelength division multiplexing transmitters integrating distributed feedback lasers and semiconductor optical amplifiers.
© 2015 Optical Society of America
PDF Article | Presentation VideoMore Like This
Guang-Hua Duan
ITh2A.2 Information Optoelectronics, Nanofabrication and Testing (IONT) 2012
John Bowers
W1B.1 Optical Fiber Communication Conference (OFC) 2015
G. Roelkens, S. Keyvaninia, Y. De Koninck, P. Mechet, T. Spuesens, M. Tassaert, S. Stankovic, G. Morthier, R. Baets, D. Van Thourhout, F. Lelarge, G.-H. Duan, S. Messaoudene, J.M. Fedeli, T. De Vries, B. Smalbrugge, E.J. Geluk, J. Bolk, and M. Smit
ATh3A.5 Asia Communications and Photonics Conference (ACP) 2013