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Conferences > IPR > 1998 > ITuH > ITuH3
  • Integrated Photonics Research
  • OSA Technical Digest (Optica Publishing Group, 1998),
  • paper ITuH3

Gbit/s Integrated Si/InGaAsTelecommunication Photodetectors

B. F. LEVINE

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Abstract

The advantages of directly bonding Si and lll-V wafers to fabricate novel integrated devices which maximize the advantages of each material are well known1,2 We will discuss planar high performance λ=1.55μm telecommunication photodetectors on a Si substrate.

© 1998 Optical Society of America

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