Non-peripheral epilayer cleaving of GaAs for hybrid device applications

J. Fujita; M. Levy; R. M. Osgood

Integrated Photonics Research
OSA Technical Digest (Optica Publishing Group, 1998),
paper ITuF3

Non-peripheral epilayer cleaving of GaAs for hybrid device applications

J. Fujita, M. Levy, and R. M. Osgood

Integrated Photonics Research 1998

British Columbia Canada
ISBN: 1-55752-521-8

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Photonic Packaging II (ITuF)

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J. Fujita, M. Levy, and R. M. Osgood, "Non-peripheral epilayer cleaving of GaAs for hybrid device applications," in Integrated Photonics Research, Vol. 4 of OSA Technical Digest (Optica Publishing Group, 1998), paper ITuF3.

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Abstract

Hybrid integration of bulk or waveguide devices of different material systems permits increased optical integration and enhanced complexity of device functionality on a single chip.

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