Abstract
Hybrid integration utilizing silicon waferboard as a platform for mounting discrete and array components, is an attractive alternative to using conventional sub-mounted devices when building low-cost, high-performance, multichannel optical transmitter and receiver modules. Silicon substrates are extremely versadle as a platform material for the following reasons: 1) both multimode and single mode fiber can be mounted into v-grooves etched into the silicon surface; 2) alignment fiduciaU formed on the silicon surface, provide a registration feature for optoelectronic devices such as emitters and detectors; 3) signal traces can be defined using conventional photo-lithography techniques on a common silicon substrate; one that carries the components as well as the optical fibers; and 4), heat can be efficiently transported away from the active devices mounted on the silicon surface through die silicon platform.
© 1996 Optical Society of America
PDF ArticleMore Like This
C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. A. Rothman, P. O. Haugsjaa, R. Holstrom, E. Meland, and W. Powazinik
WM8 Optical Fiber Communication Conference (OFC) 1991
Harry F. Lockwood
WG1 Optical Fiber Communication Conference (OFC) 1992
J.-M. Verdiell, M. Ziari, and D. F. Welch
CThK26 Conference on Lasers and Electro-Optics (CLEO:S&I) 1996