Abstract
Optoelectronics (o/e) is currently too expensive for wide-spread application. The packaging (or fiber pigtailing) of o/e components may comprise up to 90% of the component's cost for some high performance components. The development of an automated packaging system can greatly lower these packaging costs, enabling a host of new applications in areas of great economic and defense benefit to the US, including optical computer interconnects for advanced computing and ATM switch backplanes, advanced optical networks, and fiber optic gyros, to name just a few potentially high-impact applications.
© 1995 Optical Society of America
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