Abstract

At its 1993 Optical Communications Roadmap Workshop, the Optoelectronics Industry Development Association (OIDA) voted low-cost packaging to be the most critical issue facing the U. S. optoelectronics industry today. The costs associated with pigtailing and packaging operations presently represent greater than 60% of the total cost of packaged optoelectronic (OE) modules. As other elements in the manufacturing process are reduced in cost, the costs associated with pigtailing/packaging will become an even greater percentage, reaching as high as 90% of the total cost for high-volume markets.

© 1995 Optical Society of America