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Dual Channels Hybrid Integrated Receiver With High-Speed InGaAs Photodetector Array Integrated On Glass-Ceramic

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Abstract

The 1 × 2 photodetector array and transimpedance CMOS chip were mounted on a square glass-ceramic substrate platform using low-temperature polymer bonding technology. The detail to fabricate receiver and packaging technology were demonstrated.

© 2014 Optical Society of America

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