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One-step waveguide endface dicing approach for Silica-on-Silicon PIC chip

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Abstract

The minimum insertion loss of 0.055dB/facet at 1550nm wavelength is achieved for Silica-on-Silicon waveguide using Disco ZH05-SD3500-N1-70FF/01 blade with spindle revolution speed, workpiece feed speed and cooling water flow velocity of 30000r/min, 1mm/s and 1.2L/min.

© 2018 The Author(s)

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