Abstract

Femtosecond laser processing of silicon showed effective material removal, but with detrimental artifacts resulting from heating and oxidation. A thermal model was constructed to predict optimized processing parameters to mitigate heat accumulation.

© 2016 Optical Society of America

PDF Article
More Like This
Thermal Modeling and Heat Mitigation for Femtosecond-Laser-Based Silicon Processing

Jie Qiao, Lauren L. Taylor, and Jun Qiao
ATu3K.4 CLEO: Applications and Technology (CLEO_AT) 2016

Comparison of Two-Temperature and Thermal Models for Prediction of the Optimal Femtosecond Laser-Material Processing of Silicon

R. E. Scott, L. L. Taylor, and J. Qiao
ATu4C.5 CLEO: Applications and Technology (CLEO_AT) 2017

100-W Average-Power Femtosecond Fiber Laser System with Variable Parameters for Rapid Optimization of Laser Processing

Dai Yoshitomi, Hideyuki Takada, Kenji Torizuka, and Yohei Kobayashi
SM3L.2 CLEO: Science and Innovations (CLEO_SI) 2019

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription