Abstract

Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.

© 2014 Optical Society of America

PDF Article
More Like This
High NA Pupil Plane Image Polarimetry for Detection of Surface and Subsurface Damage in Optical Materials

Victor Densmore, Youngsik Kim, Geon-Hee Kim, and Tom D. Milster
FTh3G.8 Frontiers in Optics (FiO) 2014

High Resolution Subsurface Thermal Imaging using a Numerical Aperture Increasing Lens

M. G. Eraslan, A. N. Vamivakas, S. B. Ippolito, M. S. Ünlü, and B. B. Goldberg
QTuK4 Quantum Electronics and Laser Science Conference (QELS) 2005

Multiphoton Microscopy Characterization of Plasmonic Enhanced Nanodevices

Soroush Mehravar, Shiva Shahin, Byron Cocilovo, Oscar Herrera, Khanh Kieu, Robert A. Norwood, and Nasser Peyghambarian
IT2A.4 Integrated Photonics Research, Silicon and Nanophotonics (IPRSN) 2014

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription