Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems

Christian G. Koos; Wolfgang Freude; Juerg Leuthold; Luca Alloatti; Robert Palmer; Dietmar Korn; Jörg Pfeifle; Philipp C. Schindler; Matthias Lauermann; Nicole Lindenmann; Sebastian Koeber; Tobias Hoose; Muhammad Rodlin Billah; Hui Yu; Wim Bogaerts; Roel Baets; Maryse Fournier; Jean-Marc Fedeli; Raluca Dinu; Jens Bolten; Thorsten Wahlbrink; Michael Waldow

doi:10.1364/FIO.2013.FTu1E.3

Frontiers in Optics 2013

Orlando, Florida United States
6–10 October 2013
ISBN: 978-1-55752-987-9

From the session
Hybrid Integrated Photonics (FTu1E)

Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems

Christian G. Koos, Wolfgang Freude, Juerg Leuthold, Luca Alloatti, Robert Palmer, Dietmar Korn, Jörg Pfeifle, Philipp C. Schindler, Matthias Lauermann, Nicole Lindenmann, Sebastian Koeber, Tobias Hoose, Muhammad Rodlin Billah, Hui Yu, Wim Bogaerts, Roel Baets, Maryse Fournier, Jean-Marc Fedeli, Raluca Dinu, Jens Bolten, Thorsten Wahlbrink, and Michael Waldow

Frontiers in Optics 2013
OSA Technical Digest (online) (Optical Society of America, 2013),
paper FTu1E.3
•https://doi.org/10.1364/FIO.2013.FTu1E.3

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C. G. Koos, W. Freude, J. Leuthold, L. Alloatti, R. Palmer, D. Korn, J. Pfeifle, P. C. Schindler, M. Lauermann, N. Lindenmann, S. Koeber, T. Hoose, M. R. Billah, H. Yu, W. Bogaerts, R. Baets, M. Fournier, J. Fedeli, R. Dinu, J. Bolten, T. Wahlbrink, and M. Waldow, "Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems," in Frontiers in Optics 2013, I. Kang, D. Reitze, N. Alic, and D. Hagan, eds., OSA Technical Digest (online) (Optical Society of America, 2013), paper FTu1E.3.

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Related Topics
Optics & Photonics Topics
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The topics in this list come from the OSA Optics and Photonics Topics applied to this article.
- Organic materials
- Silicon photonics
Previously assigned OCIS codes
- Nanostructure fabrication (220.4241)
- Modulators (230.4110)
- Optical interconnects (200.4650)

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Abstract

The functionality of silicon photonics can be extended by combination with organic materials and by multi-chip integration. We give an overview of the underlying concepts of silicon-organic hybrid (SOH) integration and photonic wire bonding.

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Frontiers in Optics 2013

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