The functionality of silicon photonics can be extended by combination with organic materials and by multi-chip integration. We give an overview of the underlying concepts of silicon-organic hybrid (SOH) integration and photonic wire bonding.

© 2013 Optical Society of America

PDF Article
More Like This
Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration

C. Koos, W. Freude, J. Leuthold, N. Lindenmann, S. Koeber, J. Hoffmann, T. Hoose, P. Huebner, and M. R. Billah
IM4A.3 Integrated Photonics Research, Silicon and Nanophotonics (IPRSN) 2013

Silicon-Organic Hybrid (SOH) Electro-Optical Devices

C. Koos, L. Alloatti, D. Korn, R. Palmer, D. Hillerkuss, J. Li, A. Barklund, R. Dinu, J. Wieland, M. Fournier, J. Fedeli, H. Yu, W. Bogaerts, P. Dumon, R. Baets, W. Freude, and J. Leuthold
IWF1 Integrated Photonics Research, Silicon and Nanophotonics (IPRSN) 2011

Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) Integration

C. Koos, J. Leuthold, W. Freude, M. Kohl, L. R. Dalton, W. Bogaerts, A.-L. Giesecke, M. Lauermann, A. Melikyan, S. Koeber, S. Wolf, C. Weimann, S. Muehlbrandt, K. Koehnle, J. Pfeifle, R. Palmer, D. Korn, L. Alloatti, D. L. Elder, T. Wahlbrink, and J. Bolten
Tu2A.1 Optical Fiber Communication Conference (OFC) 2015


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription