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  • Frontiers in Optics 2009/Laser Science XXV/Fall 2009 OSA Optics & Photonics Technical Digest
  • OSA Technical Digest (CD) (Optica Publishing Group, 2009),
  • paper FWN2
  • https://doi.org/10.1364/FIO.2009.FWN2

Electronic-Nanophotonic Integration

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Abstract

Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.

© 2009 Optical Society of America

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