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Water-assisted silicon machining with femtosecond laser pulses

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Abstract

Water-assisted micromachining of silicon with ultra-short laser pulses is investigated.We show that water confinement provides enhanced ablation rate, improved ablation profile, and less debris re-deposition as compared to ablation in air. Theoretical modeling of laser-matter interaction in water-confined silicon ablation and experimental results with femtosecond laser pulses are presented.

© 2003 Optical Society of America

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