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Modular 3D-Printed Plasmonic Circuits for Signal Processing in THz Communications

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Abstract

THz waveguide-based integrated solutions are of great utility in Terahertz communications. In this work, we propose a new type of modular 3D-printed micro-encapsulated two-wire plasmonic waveguide components to realize reconfigurable terahertz circuits for signal processing.

© 2021 The Author(s)

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