Abstract

We demonstrate a laser annealing technique capable of compensating for parameter and fabrication non-uniformity in complex silicon photonic devices. The technique does not compromise device performance and can be used for trimming at wafer level.

© 2020 The Author(s)

PDF Article
More Like This
Trimming of Silicon-on-insulator Micro-ring Resonators by Laser Irradiation

Graham J. Sharp, Charalambos Klitis, Vera Biryukova, Barry Holmes, and Marc Sorel
CK_5_2 The European Conference on Lasers and Electro-Optics (CLEO_Europe) 2017

Post-fabrication Trimming of Silicon Photonic Circuits by Femtosecond Laser Pulses

Daniel Bachman, Zhijiang Chen, Ying Y. Tsui, Robert Fedosejevs, and Vien Van
Tu3E.1 Optical Fiber Communication Conference (OFC) 2016

Integration of III-V on Silicon Gain Devices At the Backside of Silicon-on-Insulator Wafers For Photonic Fully Integrated Circuits

Sylvie Menezo, Torrey Thiessen, Jason Mak, Jérémy Da Fonseca, Karen Ribaud, Zheng Yon, Christophe Jany, and Joyce K. S. Poon
SM4J.7 CLEO: Science and Innovations (CLEO_SI) 2020

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription