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Conferences > CLEO_SI > 2020 > SW3F > SW3F.4

Monitoring and Trimming of Integrated Silicon Photonic Circuits via Laser Irradiation

Vera Biryukova, Charalambos Klitis, and Marc Sorel

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Abstract

We demonstrate a laser annealing technique capable of compensating for parameter and fabrication non-uniformity in complex silicon photonic devices. The technique does not compromise device performance and can be used for trimming at wafer level.

© 2020 The Author(s)

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