Author Affiliations

Kunpeng Jia,^1,2,+ Xiaohan Wang,^1,2,+ Xin Ni,¹ Jian Guo,¹ Zhenda Xie,¹ Shu-Wei Huang,² and Shi-ning Zhu¹

¹National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, College of Engineering and Applied Sciences, and School of Physics, Nanjing University, Nanjing 210093, China

²Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO, USA

⁺These authors contributed equally to this work.