Abstract

We present new optical fiber designs for silicon photonic chip packing applications, including Titania-clad bend-insensitive fiber for surface coupling, D-shaped fiber for evanescent wave coupling and multicore fiber for edge coupling.

© 2020 The Author(s)

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More Like This
Optical Package Design for Silicon Photonic Chips

Yoichi Taira and Hidetoshi Numata
JTuA37 Frontiers in Optics (FiO) 2010

Ultra-dense Silicon Photonics Coupling Solution for Optical Chip Scale Package Transceiver

Qing Zhao, Xiaolu Song, Zhen Dong, Lei Gao, Ruiqiang Ji, Yanbo Li, Ling Hao, Shengmeng Fu, and Li Zeng
AF4F.4 Asia Communications and Photonics Conference (ACPC) 2016

Chip-Packaged Silicon Photonic Nanoscale Thermometers

Nikolai N. Klimov, Thomas Purdy, and Zeeshan Ahmed
AW1J.6 CLEO: Applications and Technology (CLEO_AT) 2016