Abstract

We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.

© 2020 The Author(s)

PDF Article  |   Presentation Video
More Like This
Silicon Optical Interposer for EPIC 2.5D Integration

Lim Soon Thor, Li Hong Yu, Jong Ming Chinq, Eva Wai Leong Ching, Thomas Y. L Ang, Ong Jun Rong, Phua Wee Kee, Alagappan Gandhi, Png Ching Eng, and Lim Teck Guan
T3G.1 Asia Communications and Photonics Conference (ACPC) 2020

3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, Sunwoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha Molnar, and Keren Bergman
Th4A.4 Optical Fiber Communication Conference (OFC) 2021

224-Gb/s PDM-16-QAM Modulator and Receiver based on Silicon Photonic Integrated Circuits

Po Dong, Xiang Liu, S. Chandrasekhar, Lawrence L. Buhl, Ricardo Aroca, Yves Baeyens, and Young-Kai Chen
PDP5C.6 Optical Fiber Communication Conference (OFC) 2013

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Presentation Video

Presentation video access is available to:

  1. Optica Publishing Group subscribers
  2. Technical meeting attendees
  3. Optica members who wish to use one of their free downloads. Please download the article first. After downloading, please refresh this page.

Contact your librarian or system administrator
or
Log in to access Optica Member Subscription or free downloads


More Like This
Silicon Optical Interposer for EPIC 2.5D Integration

Lim Soon Thor, Li Hong Yu, Jong Ming Chinq, Eva Wai Leong Ching, Thomas Y. L Ang, Ong Jun Rong, Phua Wee Kee, Alagappan Gandhi, Png Ching Eng, and Lim Teck Guan
T3G.1 Asia Communications and Photonics Conference (ACPC) 2020

3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects

Stuart Daudlin, Anthony Rizzo, Nathan C. Abrams, Sunwoo Lee, Devesh Khilwani, Vaishnavi Murthy, James Robinson, Terence Collier, Alyosha Molnar, and Keren Bergman
Th4A.4 Optical Fiber Communication Conference (OFC) 2021

224-Gb/s PDM-16-QAM Modulator and Receiver based on Silicon Photonic Integrated Circuits

Po Dong, Xiang Liu, S. Chandrasekhar, Lawrence L. Buhl, Ricardo Aroca, Yves Baeyens, and Young-Kai Chen
PDP5C.6 Optical Fiber Communication Conference (OFC) 2013