Abstract
We report for the first time the fabrication of high-Q SiC resonators on a 3C SiC-on-insulator platform (with no undercutting) formed using direct wafer bonding. We demonstrate Q of 42,000 for a 20 µm radius microdonut resonator with a great potential for higher Qs by chemical-mechanical polishing.
© 2018 The Author(s)
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