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High Q Integrated Photonic Microresonators on 3C SiC-on-Insulator Platform

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Abstract

We report for the first time the fabrication of high-Q SiC resonators on a 3C SiC-on-insulator platform (with no undercutting) formed using direct wafer bonding. We demonstrate Q of 42,000 for a 20 µm radius microdonut resonator with a great potential for higher Qs by chemical-mechanical polishing.

© 2018 The Author(s)

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