Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Arbitrary vertical low-loss waveguides in deposited oxide of optical interposers for low-loss 3D photonic packaging

Not Accessible

Your library or personal account may give you access

Abstract

We first demonstrate a low-loss flexible 3D waveguide on deposited oxide cladding for 3D photonic packaging using ultrafast laser inscription. Waveguide propagation loss, excess bending loss and coupling loss to SiN waveguide were characterized.

© 2018 The Author(s)

PDF Article
More Like This
Ultra-Low Loss Vertical Optical Couplers for 3D Photonic Integrated Circuits

Kuanping Shang, Shibnath Pathak, Guangyao Liu, and S. J. B. Yoo
Th1F.6 Optical Fiber Communication Conference (OFC) 2015

Glass Interposer for High-Density Photonic Packaging

Lars Brusberg, Jason R. Grenier, Şükrü Ekin Kocabaş, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry J. Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, and Katerina Rousseva
Tu3A.3 Optical Fiber Communication Conference (OFC) 2022

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers

Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, and Joris Van Campenhout
Tu2A.3 Optical Fiber Communication Conference (OFC) 2018

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved