Author Affiliations
Qing Hua Song,1,2 Pin Chieh Wu,2 Weiming Zhu,2 Wu Zhang,2 Zhongxiang Shen,2 Qing Xuan Liang,3 Zhenchuan Yang,4 Yufeng Jin,4 Yilong Hao,4 Tarik Bourouina,5 Yamin Leprince-Wang,1 and Ai-Qun Liu2,*
1Université Paris-Est, UPEM, F-77454 Marne-la-Vallée,
France
2School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
3School of Mechanical Eengineering, Xi’an Jiangtong University, Xi’an 710049,
China
4National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing 100871,
China
5Université Paris-Est, ESYCOM, ESIEE, Paris F-93162 Marne-la-Vallée,
France
*Corresponding author: eaqliu@ntu.edu.sg