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A Platform for Three-dimensional On-chip Photonics: Multi-bonded Silicon-On-Insulator wafers

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Abstract

We propose a novel platform for three dimensional photonics. A double layer 1x12 multimode interference coupler is fabricated on a double-bounded Silicon-on-insulator wafer. Optical characterizations confirm low insertion loss and uniform outputs.

© 2011 Optical Society of America

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