3D multilayer photonics platform integrated with bulk Si or SOI can enable intra-chip optical connections and data processing without interfering with the on-chip electronics. Multi-layer integration has the potential to increase device density, offers more functionality in terms of novel materials and devices stacked in a multilayer assembly. It has been shown that interlayer coupling can be achieved by creating slopes between the two layers [1-3]. In this work, fabrication and preliminary characterisation of vertical directional coupler is demonstrated for optical signal distribution between two Si layers of the device. Lumerical was used to simulate waveguide geometry and coupling length.

© 2019 IEEE

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