Thulium-doped glass has recently been highlighted as a potential candidate for amplifiers in a new telecommunications window, due to its potential for strong gain across a broad bandwidth in the 2-micron regime [1]. However, the use of such technology in a silicon or planar platform has received much less attention [2,3]. Lack of on-chip lasers is an obstacle to progress in silicon photonics with much research focused on mounting processed III-V lasers, bonding gain material, or the deposition of gain material onto SOI wafers.

© 2019 IEEE

PDF Article
More Like This
Laser Integration Technologies for Silicon Photonics

Jonathan Klamkin, Lei Wang, Bei Shi, Simone Tommaso Šuran Brunelli, Hongwei Zhao, and Bowen Song
ITh1A.1 Integrated Photonics Research, Silicon and Nanophotonics (IPRSN) 2019

Realization of a SOI-like III–V platform based on the integration of GaAs with silicon

Rajat Sharma, Hung-Hsi Lin, Matthew W. Puckett, and Yeshaiahu Fainman
SF2G.1 CLEO: Science and Innovations (CLEO_SI) 2015

Heterogeneously Integrated Laser on a Silicon Nitride Platform via Micro-Transfer Printing

Camiel Op de Beeck, Lukas Elsinger, Bahawal Haq, Günther Roelkens, and Bart Kuyken
FTu6B.1 Frontiers in Optics (FiO) 2019


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription