Abstract

The goal of this work is twofold. First we study residual mechanical bonding induced stress in state-of-the-art 980 nm high-power single-mode GaAs-based laser diodes (LD) mounted on either standard plain material (Fig. 1-a), basic bi-material (Fig. 1-b) composite, or optimized bi-material composite submounts with a standard Au-Sn eutectic alloy solder pad. Then we show how to enhance the heat dissipation from the operating LD via its submount. The motivation of this work is the understanding of the physical phenomena playing a critical role on the electro-optical performances, current consumption, reliability, and lifetime of the LD-submount assemblies.

© 2011 Optical Society of America