We present the development of an ultra-high-resolution high-dynamic-range infrared optical coherence tomography imaging system for the novel purpose of sub-surface inspection of silicon integrated-circuits. Examples of substrate thickness profiling and device feature inspection are demonstrated.

© 2010 Optical Society of America

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription