Author Affiliations

Cheng Liu,^1,± Kevin Lee,² Galen Harden,³ Anthony Hoffman,³ Huili (Grace) Xing,^2,4 Debdeep Jena,^2,4 and Jing Zhang^1,‡

¹Department of Electrical and Microelectronics Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA

²School of Electrical and Computer Engineering, Cornell University, Ithaca, NY 14853, USA

³Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA

⁴Department of Material Science and Engineering, Cornell University, Ithaca, NY 14853, USA

^± cl7007@rit.edu

^‡ Jing.Zhang@rit.edu