Abstract
We propose a 3-micron-radius, TE0/TE1 multiplexed 90-degree bend that numerically exhibits 0.8 dB bending loss and 20 dB crosstalk suppression over 30nm bandwidth on an silicon-on-insulator platform. An S-bend shows >37 dB colorless crosstalk suppression.
© 2018 The Author(s)
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