Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • 2013 Conference on Lasers and Electro-Optics Pacific Rim
  • (Optica Publishing Group, 2013),
  • paper TuN1_3

Multi-Guide Vertical Integration in InP: PIC Technology for Cost-Sensitive Applications

Not Accessible

Your library or personal account may give you access

Abstract

This paper describes the fundamentals and applications of the multi-guide vertical integration in InP, an authentic regrowth-free PIC technology for optical communications, and presents the exemplary transceiver and receiver PICs for optical access and interconnects.

© 2013 IEICE

PDF Article
More Like This
100Gb/s Receiver Photonic Integrated Circuits in InP for Applications in Fiber-Optics Interconnects

V. Tolstikhin, F. Wu, Y. Logvin, S. Ristic, Y. Tang, K. Pimenov, and A. Khajooeizadeh
IW5A.4 Integrated Photonics Research, Silicon and Nanophotonics (IPR) 2013

4 × 25 GB/s Receiver Photonic Integrated Circuits in InP for Applications in Data Center Interconnects

F. Wu, Y. Logvin, S. Ristic, Y. Tang, K. Pimenov, and A. Khajooeizadeh
AF4B.3 Asia Communications and Photonics Conference (ACP) 2013

Transmitter and Receiver Solutions for Regrowth-Free Multi-Guide Vertical Integration in InP

Scott Kuntze, Valery Tolstikhin, Fang Wu, Yury Logvin, Chris Watson, Kirill Pimenov, Ron Moore, Alan Moore, Huiling Wang, and Tania Oogarah
ITuC5 Integrated Photonics Research, Silicon and Nanophotonics (IPR) 2010

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.