Abstract

We suggested and demonstrated a novel method that can determine the thickness and refractive index of a wafer at the same time in a single measurement by using the optical comb. The thickness and refractive index of a wafer can be separated simply from optical thickness by using the various phase information obtained in spectral domain. For the feasibility test, the thickness and refractive index of a double side polished wafer were measured.

© 2010 Optical Society of America

PDF Article
More Like This
Measuring the wafer thickness and refractive index by spectral interferometry of optical frequency comb

Shilin Xiong, Yuetang Yang, and Guanhao Wu
C10F_3 Conference on Lasers and Electro-Optics/Pacific Rim (CLEOPR) 2020

Physical thickness and group refractive index measurement of bare glass panels using the optical comb for display industry

Jonghan Jin, Jungjae Park, Jong-Ahn Kim, and Jae Wan Kim
JT5A.45 Adaptive Optics: Analysis, Methods & Systems (AOMS) 2015

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription