Abstract

To utilize optical interfaces and interconnections in a electrical interconnection substrate system for System on a Package (SOP) systems, the integration of optoelectronic (OE) devices and polymer optical waveguides are essential technologies.^1,2,3 A great deal of research to date has focused upon the integration of waveguides with OE devices such as photodetectors (PDs) and host substrates which can support high density electrical interconnections (HD1). To date, reported results focus upon waveguides integrated onto substrates which contain PDs composed of the substrate material (e.g., Si and GaAs). Optimally, a system with embedded OE devices would be composed of independently optimized materials for the waveguide, PD, and electrical interconnection substrate. In fact, HDI substrates fabricated from polymers are currently attractive as a low cost HDI substrate alternative. In this paper, an integration process and measured result of a fully embedded thin film MSM PD fabricated from InGaAs which is embedded in a polymer optical waveguide which is deposited on a Si substrate will be presented, thus realizing the goal of three separate, independently optimized materials for the waveguide, substrate, and PD.

© 2002 Optical Society of America