Abstract

It is highly desirable to integrate monolithic microprocessors, network processors and optical transceiver arrays in mainstream CMOS technology for communications and signal processing on the same chip.¹ The Ultra-Thin Silicon-on-Sapphire (UTSi^®-SOS) process developed by Peregrine Semiconductor uses 100 nm silicon on top of fully insulating, optically transparent synthetic sapphire. The process has good thermal conductivity properties and thermal expansion coefficients well-matched to tlip-chip-bonded GaAs optical devices. It is one example of a Silicon-on- Sapphire CMOS process with great potential for photonic integration.³ We present the design, simulation, fabrication and test of UTSi chips containing several test circuits and subsystems useful for optical communications and interconnections.

© 2002 Optical Society of America