Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > CLEO > 2002 > CThY > CThY5
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 2002),
  • paper CThY5

Spatially-resolved Spectroscopic Strain Measurements at High-power Diode Laser Bars

J. W. Tomm, A. Gerhardt, J. -P. Landesman, P. Galtier, Y. Sainte-Marie, and J. Nagle

Not Accessible

Your library or personal account may give you access

Abstract

Device packaging involves the potential of introduction of mechanical strain and defects into semiconductor laser chips and bars. The first step on the road towards advanced packaging techniques must be the analysis how packaging affects the chips. Thus strain and defects within the laser structures must become surely measurable and detectable, respectively.

© 2002 Optical Society of America

PDF Article
More Like This
Spectroscopic measurement of packaging-induced strains in high-power laser diode arrays

J.W. Tomm, R. Müller, A. Bärwolff, T. Elsaesser, A. Gerhardt, J. Donecker, D. Lorenzen, F.X. Daiminger, S. Weiß, M. Hutter, and H. Reichl
CTuK53 Conference on Lasers and Electro-Optics (CLEO:S&I) 1999

Spontaneous Emission Measurements of Tensile Strained GalnP Laser Diodes

P.M. Smowton, G.M. Lewis, H.D. Summers, J.D. Thomson, and P. Blood
CTuW5 Conference on Lasers and Electro-Optics (CLEO:S&I) 2002

High-Power Diode Laser Bars, >250 W

M. Mikulla, M Walther, R Kiefer, J. Jandeleit, W. Brandenburg, P Loosen, R Poprawe, and G Weimann
CThF1 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2000

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use