Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > CLEO > 1999 > CThW > CThW2
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1999),
  • paper CThW2

Low-temperature direct wafer bonding and selective etching of yttrium iron garnet films on InP substrates

T. Izuhara, M. Levy, R. M. Osgood, A. Kumar, and H. Bakhru

Not Accessible

Your library or personal account may give you access

Abstract

Direct wafer bonding is an attractive technique for the heterogeneous integration of dissimilar materials, including III-V and silicon-on- insulator structures (SOI).

© 1999 Optical Society of America

PDF Article
More Like This
Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd3Ga5O12

Hideki Yokoi and Tetsuya Mizumoto
CThK7 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 1998

Characteristics of film InP layer and Si substrate bonded interface bonded by wafer direct bonding

Keiichi Matsumoto, Yoshinori Kanaya, Junya Kishikawa, and Kazuhiko Shimomura
25J3_3 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2015

Direct bonding between laser wafers and magneto-optic waveguides

Hideki Yokoi, Tetsuya Mizumoto, Koichi Maru, and Yoshiyuki Naito
CFG3 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 1996

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use