Defect in optoelectronic packaging dye to phosphorus content of the underlayer coating

K. C. Hsieh; Y. K. Tu; Y. K. Tu; S. C. Wang; S. C. Wang; H. L. Chang; H. L. Chang; C. Wang; C. Wang; C. M. Wang; C. M. Wang; J. W. Liaw; J. W. Liaw; G. L. Wang; G. L. Wang; C. H. Chen; C. H. Chen; W. H. Cheng; W. H. Cheng

Conference on Lasers and Electro-Optics
(Optica Publishing Group, 1998),
paper CTuM29

Defect in optoelectronic packaging dye to phosphorus content of the underlayer coating

K. C. Hsieh, Y. K. Tu, S. C. Wang, H. L. Chang, C. Wang, C. M. Wang, J. W. Liaw, G. L. Wang, C. H. Chen, and W. H. Cheng

Conference on Lasers and Electro-Optics 1998

San Francisco, California United States
3–8 May 1998
ISBN: 1-55752-540-4

From the session
CLEO Poster Session: I (CTuM)

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
K. C. Hsieh, Y. K. Tu, S. C. Wang, H. L. Chang, C. Wang, C. M. Wang, J. W. Liaw, G. L. Wang, C. H. Chen, and W. H. Cheng, "Defect in optoelectronic packaging dye to phosphorus content of the underlayer coating," in Conference on Lasers and Electro-Optics, D. Scifres and A. Weiner, eds., (Optica Publishing Group, 1998), paper CTuM29.

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Save article

Abstract

Prior to Au plating on optoelectronic material, a Ni underlayer is often applied to improve adhesion.

PDF Article

More Like This

Failure mechanisms in semiconductor laser packaging

J. C. Chen, W. T. Chen, S. T. Chang, J. S. Horng, H. H. Lin, M. J. Sun, W. H. Wang, and W. H. Cheng
CThC6 Conference on Lasers and Electro-Optics (CLEO:S&I) 1996

Spot-welding technique for optoelectronic packages

P. Su, T. S. Ravi, D. D. Mahoney, and D. A. Taylor
WL4 Optical Fiber Communication Conference (OFC) 1994

Overview of MEMS Technology for Packaging Optoelectronic Components

Ming C. Wu
ITuC2 Integrated Photonics Research (IPR) 1998

Previous Article Next Article